1. Touch screen with human interface,heating time,heating temperature,reflow temperature rate,advanced alarming,vacuum time all can set inside the touch screen,simple operation,easy learn.
2. PLC import from Japan,temperature control module use China famous brand,display three temperature curves,4pcs independent temperature sensor,which can measure the different place temperature of the chips,make sure the rework rate.
3. Three independent heating temperature zone,each heating temperature zone can independently set the heating temperature ,heating time,rate;six heating temperature sections,Simulate the reflow oven heating mode preheating,constant,warming,soldering,reflow soldering,cooling.
4. Auto feed chips,pick up chips,blowing chips;auto recognition chips place during alignment Multifunction mode weld,remove,mount,manual],realize semi auto and auto function,meet customer’s requirement.
5. High precision K-type Closed Loop import from USA together with our company special heating way,the soldering rang of temperature within±1 degree.
6. Imported optical alignment system with 15’’high definition monitor;high precision micrometer adjust X/Y/R axis;make sure the alignment precision within 0.01-0.02mm.
7. Top heater and mounting heater design 2 in 1 which can make the mounting more precision;there are many sizes of BGA nozzles which can meet different chips sizes,BGA nozzles can easy change,we accept customize.
8. High automatic and precision,Completely avoid human operation error; it is good for reworking lead free craft and double BGA,QFN,QFP,capacitance-type resistor components which can achieve good result.
9. Additional monitoring camera which can observe the solder ball melting and easy to check the temperature curve and the soldering result(optional function )
Technology Parameter of WDS-750 BGA Rework Machine
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Power
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6800W
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Up heater power
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1200W
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Down heater power
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1200W
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IR heater power
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4200W(2400W control)
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Power supply
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(Single Phase) AC 220V±10 50Hz
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Position way
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Optical lens+ Vshape holder+laser positioning
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Temperature control
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High precision K shape sensor(Closed Loop),up and down independent temperature heating zone,Precision can reach±1℃
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Material
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High sensitive touch screen+temperature control module+PLC+step drive
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PCB Size
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Max:500×450mm
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PCB Size
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Min: 10×10mm
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Thermo-couple Ports
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4pcs
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Chips magnification times
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2-30
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PCB thickness
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0.5-8mm
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BGA size
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0.8mm-8cm
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Min.chips pitch
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0.15mm
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Mounting BGA weight
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1000G
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Mounting precision
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±0.01mm
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Size
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L670×W780×H850mm
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Optical alignment lens
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Motor drive can move front back right left
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Weight
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About 90kg
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